Performance and Reliability of Semiconductor Devices: Volume 1108 (MRS Proceedings) »

Performance and reliability of semiconductor devices.

Sep 01, 2009 · Materials Research Society symposium proceedings; v.1108 TK7871 Papers from a winter 2008 symposium, held at the MRS Fall Meeting in Boston, present recent results from universities, national laboratories, and industries, concentrating on fundamental materials and device issues in performance and reliability. SYMPOSIUM PROCEEDINGS VOLUME 1108 Performance and Reliability of Semiconductor Devices Symposium held November 30-December 3, 2008, Boston, Massachusetts, U.S.A. EDITORS: Michael Mastro U.S. Naval Research Laboratory Washington, D.C., U.S.A. Jeffrey LaRoche Raytheon Corporation Andover, Massachusetts, U.S.A. Fan Ren University of Florida. Dec 03, 2008 · Performance and reliability of semiconductor devices: symposium held November 30-December 3, 2008, Boston, Massachusetts, U.S.A. 978-1-107-40849-4 - Performance and Reliability of Semiconductor Devices: Materials Research Society Symposium Proceedings: Volume 1108 Editors: Michael Mastro, Jeffrey LaRoche, Fan Ren, Jin-Inn Chyi and Jihyun Kim Excerpt More information. Feb 01, 2011 · Volume 1108 Symposium A – Performance and Reliability of Semiconductor Devices 2008, 1108-A09-30 Low Resistance Ohmic Contacts Formation and Mechanism of Current Transport Through p-GaN and p-AlGaN.

Volume 1108 Symposium A – Performance and Reliability of Semiconductor Devices 2008, 1108-A11-02 Contact Resistivity of NiPtSi on n-doped Silicon Activated by Laser Annealing Francois Pagette a1, Paul M Solomon a2, Paul M Kozlowski a3, Anna W Topol a4 and Wilfried Haensch a5. DOI: 10.1016/j.microrel.2005.10.013 Corpus ID: 14321829. Reliability and performance limitations in SiC power devices @articleSingh2006ReliabilityAP, title=Reliability and performance limitations in SiC power devices, author=Ranbir Singh, journal=Microelectron. Recent Achievement in the GaN Epitaxy on Silicon and Engineering Substrates - Volume 1108 - Wilk Arnaud, Melania Lijadi, Robert Langer, Philippe Bove, James Thorpe, Hervé Blanck, Virginie Hoel, Nicolas Defrance, Jean-Claude DeJaeger.

MRS Proceedings, Vol. 421, Issue., CrossRef;. the reliability of the devices depends intricately on both the crystalline perfection of the complex buried-heteroepitaxial semiconductor structures as well as the qualities of structures external to the semiconductor, such as electrical contact, dielectric coating, bonding, and packaging. Results of first-principles supercell calculations for Gd impurities, with and without O-impurities in the same cell are presented. The possibility of colossal magnetic moments, as reported by Dhar et al., [Phys. Rev. Lett. 94, 037205 2005] is discussed in view of the results.Particular attention is paid to the size of the conduction band spin splitting, induced by Gd. Certainly materials may be applied in various innovative ways to provide new performances in devices and systems. In any materials and device evaluation, reliability issues in passivation and packaging of semiconductor device structures provide a base knowledge that may be. Organic Semiconductor-Metal Devices,” Materials Research Society Symposium Proceedings Fall 2008 MRS Conference, Vol. 1115, 1115-H08-40, 2009. W. T. Wondmagegn, and R. J. Pieper, “Impact of Gate Metal Work functions on the device performance of organic thin film transistors,” Materials Research Society Symposium.

MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Volume 1108 — Performance and Reliability of Semiconductor Devices, M. Mastro, J. LaRoche, F. Ren, J-I. Chyi, J. Kim, 2009, ISBN 978-1-60511-080-6 Volume 1109E —Transparent Conductors and Semiconductors for. P. Nagaiah, V. Tokranov, M. Yakimov, S. OktyabrskyStrained quantum wells for p-channel InGaAs CMOS, performance and reliability of semiconductor devices MRS Proc., 1108 2009, pp.. “Multigate semiconductor device with vertical channel current and method of fabrication”, J. M. Cleeves and V. Subramanian, US Patent 6677204. performance, and reliability considerations”, V. Subramanian, 2002 Topical Research. S. Molesa, D. Redinger, D. Huang, and V. Subramanian, Proceedings of the Materials Research Society Spring.

Gallium Nitride Electronic Devices.

In Proceedings of the 2014 IEEE International Conference on Simulation of Semiconductor Processes and Devices SISPAD, Yokohama, Japan, 9–11 September 2014; pp. 97–100. [ Google Scholar ] Park, P.S.; Rajan, S. Simulation of Short-Channel Effects in N- and Ga-Polar AlGaN/GaN HEMTs. Two methods of defect‐selective etching of SiC are described: i orthodox etching in molten KOH–NaOH eutectic with 10% of MgO powder EM etch and ii electroless photo‐etching in aqueous KOH so. Article in MRS Online Proceeding Library Archive 1432 · January 2012. The focus of this effort is on performance, reliability and manufacturability. Compound semiconductor devices are in. The electromigration performance of copper-based conductors is reviewed critically. electromigration has been identified as a potential wear-out failure mode for semiconductor devices. Journal description. The MRS Online Proceedings Library Archive includes more than 100,000 peer-reviewed papers online—proceedings published from Volume 1 through the 2015 MRS Spring Meeting.

Highlight all BibTeX Format @inproceedingsOPL:8134816,author = Prasad,S.J. and Hultine,E.,title = Reliability of Carbon Doped Base AlGaAs/GaAs HBTs as a Function of Collector Current. Jun 21, 2010 · A heterojunction field-effect transistor HFET was fabricated of nonpolar cubic AlGaN/GaN grown on Arimplanted 3C–SiC 001 by molecular beam epitaxy. The device shows a clear field effect at positive bias voltages with V th = 0.6 V.The HFET output characteristics were calculated using ATLAS simulation program. The electron channel at the cubic AlGaN/GaN interface was detected by room. Invited “Prospects for organic semiconductor based devices and circuits: applications, performance, and reliability considerations”, V. Subramanian, 2002 Topical Research Conference on Reliability.

A brief introduction to the issues related to the mechanical properties of MEMS components in terms of their functionality, types of loading and modes of operation is presented. At the microscale, for most cases, some mechanical properties including strength increase. However, surface phenomena such as adhesion/stiction become important as the aspect ratio of the components decreases. Neeraj K. Jha, V. Ramgopal, J.C.S Woo, "Optimization of SIngle Halo p-MOSFET Implant Parameters for Improved Analog Performance and Reliability," Proceedings of the 32th European Solid-State Device Reseach Conference, 2002, Florence, Italy, p603-606. Various research programs have been devoted to this topic in recent years. Among them are the Swiss LESIT program 1993 -1995 [1] and the RAPSDRA reliability of advanced power semiconductor devices for railway traction applications, 1995 -1998 project [2] within Brite EuRam.

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