Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics - 2004 (MRS Proceedings) »

Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics - 2004 MRS Proceedings 1st Edition by R. J. Carter Author. Apr 13, 2015 · "This proceedings volume contains 60 papers presented at Symposium F, 'Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics, ' which was held April 13-15 at the 2004 MRS Spring Meeting in San Francisco, California."--Page xiii. 978-1-107-40922-4 - Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics 2004: Materials Research Society Symposium Proceedings: Volume 812 Editors: R. J. Carter, C. S. Hau-Riege, G. M. Kloster, T.-M. Lu and S. E. Schulz Frontmatter More information.

Materials, technology and reliability for advanced interconnects and low-k dielectrics: symposium held April 13-15 2004, San Francisco, California / editors R.J. Carter. [et al.] Date: 2004. Dec 17, 2014 · Two invited papers cover the fields of low-k dielectrics and new integration approaches allowing reduction of plasma damage: "Toward Successful Integration of Porous Low-k Materials: Strategies Addressing Plasma Damage" by K. Lionti et al., and "Electrical Reliability Challenges of Advanced Low-k Dielectrics" by Chen Wu et al. Title:Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics II Desc:Proceedings of a meeting held 16-20 April 2001, San Francisco, California, USA.Symposium L at the 2001 MRS Spring Meeting Series:Materials Research Society Symposium Proceedings Volume 714 ISBN:9781558996502 Pages:106 1 Vol Format:Softcover TOC:View Table of Contents. Dec 17, 2014 · have made the Cu/low-k technology mature. OSG lo w-k materials. of Advanced Low-k Dielectrics. Product Information About The Product Finding new materials for copper/low-k interconnects is. Mar 01, 2010 · Tőkei, M. Saglimbeni, M. Van Hove, Detection of Cu and H 2 O in low-k dielectrics by TVS measurements, in: Proc. MRS 2006, San Francisco, CA, Materials, Technology and Reliability of low-k Dielectrics and Copper Interconnects, 2006, pp. 0914-F02-02.

Reliability of Dielectric Barrier Films in Copper Damascene Applications - Volume 812 - Albert S. Lee, Annamalai Lakshmanan, Nagarajan Rajagopalan, Zhenjiang Cui,. The use of such materials is challenging in the field of mechanical reliability, such as stress-induced voiding in copper interconnects and cracking of low-k dielectrics. Up to now these two. 2004 MRS Spring Meeting & Exhibit. April 12-16, 2004 San Francisco. Symposium F—Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics.

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